Teleconix manufactures aerospace-grade flexible circuits built to IPC-6013 Class 3 standards for industrial drones, flight avionics, multi-axis gimbals, and satellite systems — delivering superior SWaP weight reduction, extreme thermal endurance, and fail-safe signal integrity.
Teleconix manufactures aerospace-grade flexible circuits built to IPC-6013 Class 3 standards for industrial drones, flight avionics, multi-axis gimbals, and satellite systems — delivering superior SWaP weight reduction, extreme thermal endurance, and fail-safe signal integrity.
Industrial UAVs, eVTOL aircraft, and aerospace avionics operate under severe high-G vibration, extreme thermal swings (-55°C to +150°C), and stringent SWaP weight constraints where electrical failure is never an option.
High-frequency rotor vibrations and aerospace launch forces cause severe solder and trace fatigue. Engineered to IPC-6013 Class 3 aerospace standards, our flexible circuits utilize ultra-ductile rolled annealed (RA) copper, optimized bend radiuses, and structural polyimide stiffeners to absorb non-stop mechanical oscillation without micro-fractures.
From high-altitude freezing conditions to intense motor bay heat and space vacuum environments, our aerospace FPCs use low-outgassing adhesiveless polyimide (FCCL) substrates. They resist thermal expansion, dielectric breakdown, and layer delamination across severe thermal cycling from -55°C to +150°C.
Replacing heavy wire harnesses with ultra-thin multi-layer flex and rigid-flex circuits delivers up to 70% SWaP weight reduction—directly extending UAV flight endurance and payload capacity. Integrated silver/copper shielding grids provide 50dB+ attenuation to protect flight controllers from intense motor RFI/EMI noise.
We engineer mission-critical flexible circuits that combine high-current motor power distribution with low-loss avionics telemetry, eliminating harness complexity and maximizing SWaP efficiency in UAV and aerospace platforms.
Utilizing thermally conductive polyimide dielectrics and strategic heavy copper planes to rapidly dissipate localized hotspots generated by Electronic Speed Controllers (ESCs), avionics processors, and high-power motor drives across extreme -55°C to +150°C operating envelopes.
Manufactured using space-grade adhesiveless polyimide (FCCL) and NASA-compliant low-outgassing coverlays. Certified for zero-defect operation under severe high-G launch shocks, thermal-vacuum cycling, and continuous high-altitude vibration.
Combines heavy copper traces (up to 3 oz/4 oz) for high-thrust multi-rotor motor propulsion with 0.035mm controlled-impedance lines (±5%) for LiDAR, RTK GPS, and 4K optical downlink feeds—reducing airframe weight by up to 70%.
Engineered with premium rolled annealed (RA) copper foil to withstand over 2 million continuous bending and twisting cycles inside 3-axis stabilized camera gimbals, sensor turrets, and moving aerodynamic flight control surfaces without trace cracking.
We eliminate the sales fluff and middlemen. Our dedicated engineering squad works directly with your Gerber files to optimize your layouts for manufacturing, reducing production risks and field failures while maintaining strict cost advantages.
Precision etching, laser drilling, and automated optical inspection lines dedicated to flexible circuit production.
Flying probe and fixture-based testing verifies every net for opens, shorts, and impedance compliance before shipment.
Certified polyimide, copper, and adhesive materials with full lot traceability for automotive and medical accountability.
DFM-driven stack-up design tailored to your exact bend radius, layer count, impedance, and form-factor requirements.
Flexible circuit solutions for battery management, energy storage, solar inverters, and EV charging systems.
Model: TLX-DFPC-OLED01
Model: TLX-ROB-JNT01
Model: TLX-AERO-ESC01
Model: TLX-AUTO-BMS01
Model: TLX-CARD-BIO01
Model: TLX-COMM-5G01
Find quick answers to common technical queries regarding IPC-6013 Class 3 aerospace compliance, SWaP weight reduction, extreme thermal/vacuum endurance, dynamic gimbal flexing, and turnkey SMT assembly for Industrial UAV & Aerospace FPCs.
Yes. Our Class 10,000 dust-free aerospace manufacturing facility supports seamless scaling from rapid prototyping to volume production. We maintain dedicated Roll-to-Roll (R2R) exposure lines, automated laser micro-via drilling, and high-precision SMT lines under strict IPC-6013 Class 3 quality control to ensure flawless continuity across your UAV and aerospace production runs.
Teleconix new-energy FPCs simplify wiring, improve reliability, and reduce assembly cost across battery packs, inverters, and charging infrastructure.
Overcome severe mechanical stress and extreme spatial constraints in your automated hardware. We design and manufacture custom flexible circuits engineered to endure over 2 million continuous bending cycles in multi-axis robotic joints, bionic grippers, and autonomous AGV/AMR platforms.
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Know MoreExplore engineering articles, design guides, and application notes from our R&D team to optimize your next FPC or rigid-flex project.
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
Need a reliable manufacturing partner for your next project? Our global support team is standing by.
Trusted by global industries for high-reliability FPC, rigid-flex PCB, and turnkey FPC assembly solutions.
