Display FPC
Whether building, maintaining or repairing oil rigs, platforms and subsea fixtures, having the right welding equipment is critical for safety and efficiency in harsh marine environments.
Industrial HMI & TFT-LCD Module FPC
- Board thickness: 0.15 mm
- Material: Standard Industrial Polyimide
- Copper thickness: 1 OZ (35 μm)
- Surface treatment: Immersion Gold (ENIG)
- Minimum line width/line spacing: 0.075 mm / 0.075 mm
- PI reinforcement thickness: FR4 Stiffener (0.30 mm) + Golden Finger Contacts (0.30 mm)
Ultra-Fine 25μm Fine-Pitch Routing & COF Packaging
Using advanced Laser Direct Imaging (LDI) and precision vacuum etching, Teleconix achieves line width and spacing down to 25 μm / 25 μm (0.025 mm). Specially engineered for Chip-on-Film (COF) packaging, display driver IC (DDIC) bonding, and zero-bezel AMOLED/OLED screens, providing maximum routing density within ultra-compact display borders.
100% Electrical Testing & High-Speed Signal Integrity
Every display FPC undergoes 100% automated flying probe testing, AOI inspection, and TDR impedance validation (±5% tight tolerance). Optimized for high-bandwidth MIPI D-PHY/C-PHY, eDP, and LVDS differential pairs, ensuring jitter-free transmission, zero video lag, and zero screen artifacts on 120Hz/144Hz high-refresh display panels.
Sub-0.08mm Ultra-Thin Profile & Dynamic Foldability
Constructed with premium adhesiveless polyimide (FCCL) and ultra-thin rolled annealed (RA) copper foil, our display flex circuits achieve a total stack-up thickness below 0.08 mm. They endure tight bend radiuses (<0.5 mm) and over 200,000 dynamic folding cycles without trace cracking, perfectly fitting foldable smartphones, curved automotive dashboards, and VR headsets.
Proven Application Solutions for Your Industry
Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.
Explore Related Flexible Circuit Hardware
Biometric Smart Payment Card Fingerprint Sensor FPC
Model: TLX-CARD-BIO01
Board thickness: 0.045 mm (45 μm)
Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
Heavy-Copper EV Battery Pack BMS & CCS FPC
Model: TLX-AUTO-BMS01
Board thickness: 0.22 mm
Copper thickness: 3 OZ (105 μm) Heavy Copper
Heavy-Copper ESC & Propulsion Power Distribution FPC
Model: TLX-AERO-ESC01
Board thickness: 0.25 mm
Copper thickness: 3 OZ (105 μm) / 4 OZ Heavy Copper
Multi-Branch Humanoid Robotic Joint FPC
Model: TLX-ROB-JNT01
Board thickness: 0.15 mm
Copper thickness: 1 OZ (35 μm) Rolled Annealed (RA) Copper
Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.