Teleconix manufactures fine-pitch, high-density FPCs for LCD, OLED, mini-LED displays, camera modules, and optical sensors — delivering stable signal transmission and exceptional brightness control.
Teleconix manufactures fine-pitch, high-density FPCs for LCD, OLED, mini-LED displays, camera modules, and optical sensors — delivering stable signal transmission and exceptional brightness control.
High-resolution OLED, AMOLED, and LCD screens require dense routing, tight impedance control, and ultra-thin profiles in areas where every micron counts.
High-resolution 4K/8K panels need thousands of micro-traces routed within a minimal bezel area. Our High-Density Interconnect (HDI), microvia, and Chip-on-Film (COF) technologies route fine-pitch signals down to 0.035mm line/space reliably for ultra-narrow bezel displays.
MIPI D-PHY/C-PHY, eDP, LVDS, and high-speed display data links demand strict 50Ω/100Ω impedance control and low crosstalk. We validate display stack-ups with 3D Polar field solvers and 100% TDR testing to guarantee lag-free 120Hz/144Hz screen refresh rates.
Foldable smartphones, smartwatches, and bezel-less devices demand display FPCs that are both sub-0.1mm ultra-thin and mechanically robust. We optimize rolled annealed (RA) copper weight, coverlay thickness, and stiffeners for tight bend radiuses down to 0.5mm without trace delamination.
Our display FPCs combine fine-pitch etching, controlled impedance, and ultra-thin materials to enable the next generation of screens and cameras.
Ultra-fine trace and space down to 25 μm (0.025 mm) engineered for high-density Display Driver IC (DDIC) bonding, Chip-on-Film (COF) packaging, and high-resolution AMOLED panel routing under extreme space constraints.
Utilizing adhesiveless polyimide (FCCL) and ultra-thin copper foils, we reduce total FPC stack-up thickness to under 0.08 mm. This enables tight bend radiuses (<0.5 mm) required for zero-bezel OLED screens, curved displays, and foldable smartphone hinges.
Strict ±5% impedance control on 50Ω single-ended and 100Ω differential pairs for MIPI D-PHY/C-PHY, eDP, and LVDS display interfaces, ensuring lag-free 120Hz/144Hz refresh rates and jitter-free 4K/8K visual transmission.
Flat ENEPIG and high-purity Immersion Gold surface finishes engineered for seamless Anisotropic Conductive Film (ACF) hot-bar pressing onto glass and flexible OLED substrates (COG/COP/COF).
We eliminate the sales fluff and middlemen. Our dedicated engineering squad works directly with your Gerber files to optimize your layouts for manufacturing, reducing production risks and field failures while maintaining strict cost advantages.
Precision etching, laser drilling, and automated optical inspection lines dedicated to flexible circuit production.
Flying probe and fixture-based testing verifies every net for opens, shorts, and impedance compliance before shipment.
Certified polyimide, copper, and adhesive materials with full lot traceability for automotive and medical accountability.
DFM-driven stack-up design tailored to your exact bend radius, layer count, impedance, and form-factor requirements.
High-density flex circuits for displays, cameras, and optical modules in consumer, automotive, and industrial applications.
Model: TLX-DFPC-OLED01
Model: TLX-ROB-JNT01
Model: TLX-AERO-ESC01
Model: TLX-AUTO-BMS01
Model: TLX-CARD-BIO01
Model: TLX-COMM-5G01
Find quick answers to common technical queries regarding 25μm fine-line etching limits, COF/COP ACF bonding, high-speed MIPI signal integrity, and ultra-thin foldable stack-ups for Display FPCs.
Yes. Our Class 10,000 dust-free flexible PCB factory floor supports seamless volume production. We maintain dedicated Roll-to-Roll (R2R) fine-line etching exposure lines and high-precision SMT placement to ensure your OLED, LCD, and Mini-LED display FPC orders scale smoothly from sample qualification to high-yield mass production.
Teleconix display and optical FPCs provide the fine-pitch, high-speed interconnects that modern panels, cameras, and optical sensors demand.
Overcome severe mechanical stress and extreme spatial constraints in your automated hardware. We design and manufacture custom flexible circuits engineered to endure over 2 million continuous bending cycles in multi-axis robotic joints, bionic grippers, and autonomous AGV/AMR platforms.
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Teleconix manufactures aerospace-grade flexible circuits built to IPC-6013 Class 3 standards for industrial drones, flight avionics, multi-axis gimbals, and satellite systems — delivering superior SWaP weight reduction, extreme thermal endurance, and fail-safe signal integrity.
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Teleconix delivers advanced flexible interconnects for ADAS, in-vehicle infotainment, powertrain control, and battery management systems — engineered for performance in intelligent automotive systems.
Know MoreExplore engineering articles, design guides, and application notes from our R&D team to optimize your next FPC or rigid-flex project.
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
Need a reliable manufacturing partner for your next project? Our global support team is standing by.
Trusted by global industries for high-reliability FPC, rigid-flex PCB, and turnkey FPC assembly solutions.
