Teleconix
Wearable Continuous Glucose Monitor (CGM) & Biosensor Patch FPC

Wearable Continuous Glucose Monitor (CGM) & Biosensor Patch FPC

  • Board thickness: 0.05 mm (50 μm)
  • Material: ISO 10993 Certified Biocompatible Adhesiveless Polyimide (FCCL)
  • Copper thickness: 1/3 OZ (12 μm)
  • Surface treatment: ENIG (Electroless Nickel Immersion Gold) / Hard Gold Plating
  • Minimum line width/line spacing: 0.030 mm / 0.030 mm
  • PI reinforcement thickness: Ultra-Thin Laser-Cut PI Stiffener (0.05 mm) + Medical-Grade Adhesive (PSA) Liner
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ISO 13485 Medical Compliance & Autoclave Sterilization Resilience

ISO 13485 Medical Compliance & Autoclave Sterilization Resilience

Manufactured in Class 10,000 dust-free cleanrooms under strict ISO 13485 medical device quality management systems. We exclusively utilize ISO 10993 certified biocompatible adhesiveless polyimide (FCCL) and non-cytotoxic coverlays. Our medical-grade FPCs endure repeated autoclave steam sterilization (up to +134°C), ethylene oxide (EtO) gas, gamma irradiation, and hospital-grade chemical wiping without trace delamination or dielectric degradation.

2 Million+ Dynamic Flex Cycles for Surgical Endoscopes & Catheters

2 Million+ Dynamic Flex Cycles for Surgical Endoscopes & Catheters

Engineered with high-ductility rolled annealed (RA) copper foil and zero-stress neutral bend axis modeling. Our ultra-flexible circuits withstand over 2 million continuous bending, twisting, and articulating cycles inside steerable surgical endoscopes, laparoscopic instruments, and wearable diagnostic sensors without copper micro-fractures, trace fatigue, or intermittent signal loss.

0.035mm Micro Fine-Pitch Routing & Ultra-Low-Noise EMI Shielding

0.035mm Micro Fine-Pitch Routing & Ultra-Low-Noise EMI Shielding

Using precision Laser Direct Imaging (LDI), Teleconix achieves line width and spacing down to 0.035 mm (1.4 mil) with flat coplanar ENEPIG surface plating for reliable micro-wire bonding and micro-BGA soldering. Integrated micro-thin silver or copper EMI shielding films provide up to 50dB attenuation to eliminate electromagnetic noise, guaranteeing crystal-clear signal feeds for high-resolution ultrasound transducers, ECG, and EEG diagnostic monitors.

Proven Application Solutions for Your Industry

Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.

Explore Related Flexible Circuit Hardware

Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote

Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.

100% Secure NDA Protection

100% Secure NDA Protection

Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.

24-Hour Engineering Feedback

24-Hour Engineering Feedback

Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.

Flexible Prototyping to Mass Scale

Flexible Prototyping to Mass Scale

Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.

Turnkey FPC Assembly (FPCA)

Turnkey FPC Assembly (FPCA)

We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.

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