Teleconix
High-Frequency Telemetry & Phased-Array LCP Antenna FPC

High-Frequency Telemetry & Phased-Array LCP Antenna FPC

  • Board thickness: 0.12 mm
  • Material: Ultra-Low-Loss Liquid Crystal Polymer (LCP)
  • Copper thickness: 1/2 OZ (18 μm)
  • Surface treatment: Immersion Silver / ENIG
  • Minimum line width/line spacing: 0.035 mm / 0.035 mm
  • PI reinforcement thickness: High-Frequency FR4 Stiffener (0.20 mm) + Double-Sided Copper EMI Shielding Grid
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IPC-6013 Class 3 Aerospace Reliability & Extreme Thermal Resilience

IPC-6013 Class 3 Aerospace Reliability & Extreme Thermal Resilience

Manufactured to strict IPC-6013 Class 3 aerospace specifications using NASA/ESA low-outgassing adhesiveless polyimide (FCCL) laminates. Our aerospace flexible circuits resist dielectric breakdown, thermal expansion, and trace delamination across extreme flight temperatures from -55°C to +150°C, vacuum environments, and continuous high-G launch vibration.

SWaP Weight Optimization & Hybrid Power-Telemetry Routing

SWaP Weight Optimization & Hybrid Power-Telemetry Routing

Replacing heavy point-to-point round wire harnesses with ultra-thin multi-layer flex and rigid-flex circuits delivers up to 70% SWaP (Size, Weight, and Power) reduction—directly maximizing UAV flight endurance and payload capacity. We integrate heavy copper power paths (up to 3 oz/4 oz) for propulsion motors alongside 0.035mm controlled-impedance lines with 50dB+ EMI shielding for LiDAR and 4K optical downlinks.

2 Million+ Dynamic Flex Cycles for 3-Axis Gimbal Payloads

2 Million+ Dynamic Flex Cycles for 3-Axis Gimbal Payloads

Engineered with high-ductility rolled annealed (RA) copper foil and zero-stress neutral-axis modeling. Our flex ribbons endure over 2 million continuous bending, twisting, and high-frequency pivoting cycles inside 3-axis stabilized camera gimbals, multi-spectral sensor turrets, and moving flight control surfaces without trace cracking or micro-fractures.

Proven Application Solutions for Your Industry

Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.

Explore Related Flexible Circuit Hardware

Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote

Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.

100% Secure NDA Protection

100% Secure NDA Protection

Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.

24-Hour Engineering Feedback

24-Hour Engineering Feedback

Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.

Flexible Prototyping to Mass Scale

Flexible Prototyping to Mass Scale

Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.

Turnkey FPC Assembly (FPCA)

Turnkey FPC Assembly (FPCA)

We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.

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