Teleconix
Foldable Smartphone Dynamic Hinge Multi-Layer Interconnect FPC

Foldable Smartphone Dynamic Hinge Multi-Layer Interconnect FPC

  • Board thickness: 0.075 mm (75 μm)
  • Material: Ultra-Thin Adhesiveless Polyimide (FCCL)
  • Copper thickness: 1/3 OZ (12 μm) High-Ductility Rolled Annealed (RA) Copper
  • Surface treatment: ENIG (Electroless Nickel Immersion Gold)
  • Minimum line width/line spacing: 0.030 mm / 0.030 mm
  • PI reinforcement thickness: Laser-Cut PI Stiffener (0.10 mm) + Double-Sided Matte Black Conductive Shielding Film
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Ultra-Low-Loss LCP & MPI Substrates for 5G/6G RF Antennas

Ultra-Low-Loss LCP & MPI Substrates for 5G/6G RF Antennas

Engineered with advanced Liquid Crystal Polymer (LCP) and Modified Polyimide (MPI) dielectrics featuring ultra-low dielectric constant (Dk < 3.0) and dissipation factor (Df < 0.002). Ideal for 5G Sub-6GHz, mmWave antenna arrays, satellite communication terminals, and Wi-Fi 7 modules, delivering minimum signal insertion loss and exceptional high-frequency transmission stability under tight space constraints.

25–35μm Fine-Pitch HDI Routing & Micro-B2B Integration

25–35μm Fine-Pitch HDI Routing & Micro-B2B Integration

Utilizing advanced Laser Direct Imaging (LDI) and precision micro-via drilling, Teleconix achieves ultra-fine trace width and spacing down to 25 μm / 25 μm (0.025 mm). Supports high-density multi-layer stack-ups, micro-BGA components, and fine-pitch Board-to-Board (B2B) connectors, maximizing internal component density inside flagship smartphones, ultra-thin tablets, and mobile POS handhelds.

Sub-0.08mm Ultra-Thin Dynamic Foldability & Multi-Layer EMI Shielding

Sub-0.08mm Ultra-Thin Dynamic Foldability & Multi-Layer EMI Shielding

Constructed with adhesiveless polyimide and ductile rolled annealed (RA) copper foil to achieve an ultra-thin stack-up under 0.08 mm. Designed to endure over 200,000 dynamic folding cycles in foldable smartphone hinges and multi-axis sliders, while integrated vacuum-sputtered copper/silver EMI shielding films provide 50dB+ attenuation to eliminate internal RF crosstalk between high-power modems and camera sensors.

Proven Application Solutions for Your Industry

Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.

Display FPC

Display FPC

Whether building, maintaining or repairing oil rigs, platforms and subsea fixtures, having the right welding equipment is critical for safety and efficiency in harsh marine environments.

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Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote

Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.

100% Secure NDA Protection

100% Secure NDA Protection

Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.

24-Hour Engineering Feedback

24-Hour Engineering Feedback

Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.

Flexible Prototyping to Mass Scale

Flexible Prototyping to Mass Scale

Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.

Turnkey FPC Assembly (FPCA)

Turnkey FPC Assembly (FPCA)

We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.

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