Biometric Smart Payment Card Fingerprint Sensor FPC
Model: TLX-CARD-BIO01
Board thickness: 0.045 mm (45 μm)
Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
Consumer & Financial Card FPC
High-precision, ultra-thin FPC and rigid-flex manufacturing tailored for EMV financial smart cards, biometric payment cards, smartwatches, TWS earbuds, and mobile consumer hardware. Engineered for sub-0.1mm thickness, fine-pitch COB bonding, and high durability under continuous daily flexing and twisting.
The Foundation of Reliable Consumer & Financial Card FPCs
Why standard flexible circuits fail in ultra-thin payment cards and smart wearables—and how Teleconix eliminates the root causes.
As an R&D-driven flexible circuit manufacturer, we deeply understand the engineering challenges of extreme miniaturization and daily physical endurance in personal hardware. Our Consumer and Financial Card FPC product lines focus on ultra-thin single-sided, double-sided, and multi-layer flex configurations—specially engineered for EMV financial smart cards, biometric payment cards, TWS earbuds, smartwatches, and compact mobile devices.
From ultra-thin 0.05mm polyimide substrate selection to high-pressure cold-lamination compatibility testing, every smart card and wearable FPC undergoes rigorous engineering review. We utilize fine-pitch copper traces, adhesiveless FCCL materials, and specialized ENEPIG surface plating for seamless Chip-on-Board (COB) and secure payment IC bonding. Our precision manufacturing guarantees flawless signal integrity, ideal card flexibility, and zero trace cracking under continuous daily bending, twisting, and pocket pressure.
Featured FPC & Rigid-Flex Configurations
Explore our most requested flexible circuit configurations. Each design is optimized for specific layer counts, copper weights, bending requirements, and environmental reliability.
Dynamic CVV & e-Paper Display Smart Card FPC
Model: TLX-CARD-CVV02
Board thickness: 0.06 mm (60 μm)
Copper thickness: 1/3 OZ (12 μm)
High-Q Precision Etched Dual-Interface NFC Antenna Inlay FPC
Model: TLX-CARD-NFC03
Board thickness: 0.05 mm (50 μm)
Copper thickness: 1/2 OZ (18 μm) Rolled Annealed (RA) Copper
Cold Storage Crypto Hardware Wallet Card FPC
Model: TLX-CARD-CRPT04
Board thickness: 0.08 mm
Copper thickness: 1/2 OZ (18 μm)
True Wireless Stereo (TWS) Earbud & Charging Case Micro FPC
Model: TLX-CONS-TWS05
Board thickness: 0.07 mm
Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
Smart Wearable Health Ring & Biosensor Multi-Flex FPC
Model: TLX-CONS-RING06
Board thickness: 0.06 mm (60 μm)
Copper thickness: 1/3 OZ (12 μm)
Biometric Smart Payment Card Fingerprint Sensor FPC
Model: TLX-CARD-BIO01
Board thickness: 0.045 mm (45 μm)
Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
Dynamic CVV & e-Paper Display Smart Card FPC
Model: TLX-CARD-CVV02
Board thickness: 0.06 mm (60 μm)
Copper thickness: 1/3 OZ (12 μm)
High-Q Precision Etched Dual-Interface NFC Antenna Inlay FPC
Model: TLX-CARD-NFC03
Board thickness: 0.05 mm (50 μm)
Copper thickness: 1/2 OZ (18 μm) Rolled Annealed (RA) Copper
Cold Storage Crypto Hardware Wallet Card FPC
Model: TLX-CARD-CRPT04
Board thickness: 0.08 mm
Copper thickness: 1/2 OZ (18 μm)
True Wireless Stereo (TWS) Earbud & Charging Case Micro FPC
Model: TLX-CONS-TWS05
Board thickness: 0.07 mm
Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
Smart Wearable Health Ring & Biosensor Multi-Flex FPC
Model: TLX-CONS-RING06
Board thickness: 0.06 mm (60 μm)
Copper thickness: 1/3 OZ (12 μm)
Built for Unmatched Smart Card & Consumer Reliability
Driven by high-precision engineering, certified materials, and 100% electrical testing, every Teleconix flexible circuit is optimized to eliminate trace cracking, lamination failure, and signal loss in ultra-thin wearables and payment cards.
High Flexibility for Daily Card & Wearable Bending
We use premium rolled annealed (RA) copper foil and adhesiveless polyimide laminates. This ensures your flexible circuits withstand continuous pocket twisting, daily bending, and wrist motion in financial payment cards and smartwatches without trace micro-cracking.
Ultra-Thin Sub-0.1mm Form Factor
By engineering ultra-thin flexible substrates down to 0.05mm, our FPCs seamlessly laminate inside standard ISO 7810 financial cards, TWS earbud stalks, and sleek smart rings without adding excess thickness or weight.
High-Pressure Lamination & Thermal Resistance
Smart cards undergo demanding manufacturing. Our financial card FPCs utilize specialized thermosetting coverlays and adhesive formulations that withstand high-pressure cold-lamination processes and elevated temperatures without delamination or warping.
Fine-Pitch COB & Biometric IC Bonding
We manufacture ultra-precise layouts down to 0.035mm line width with flat ENEPIG surface plating. This supports clean, reliable Chip-on-Board (COB) bonding for EMV secure payment chips, fingerprint sensors, and Bluetooth controllers.
Application-Driven Solutions
Discover how our FPC and rigid-flex architectures solve critical spatial, thermal, and signal challenges across automotive, robotics, display, and industrial systems.
AI & Robotics & Special Industrial FPC
Take on wear, corrosion and abrasion that can damage vital equipment and components, resulting in costly downtime and production losses.
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Display FPC
Whether building, maintaining or repairing oil rigs, platforms and subsea fixtures, having the right welding equipment is critical for safety and efficiency in harsh marine environments.
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High-End Industrial UAV & Commercial Aerospace FPC
When welding on pipe for oil & gas, sewer and construction-related industries, you need equipment that delivers consistent quality and meets strict industry standards.
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Smart Automotive Electronics FPC
Advanced lighting connection solutions for outdoor LED applications, providing weather-resistant and energy-efficient connectivity.
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Frequently Asked Questions
Find quick answers to common technical queries regarding ultra-thin substrate limits, card lamination compatibility, EMV chip bonding, and quality verification standards for Consumer & Financial Card FPCs.
Yes. Our Class 10,000 dust-free flexible PCB factory floor supports seamless volume ramp-up. We maintain dedicated Roll-to-Roll (R2R) exposure lines and automated SMT placement so the same engineering team that qualified your prototype manages your mass production flexible PCB board runs.
Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.