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High-Q Precision Etched Dual-Interface NFC Antenna Inlay FPC

High-Q Precision Etched Dual-Interface NFC Antenna Inlay FPC

  • Board thickness: 0.05 mm (50 μm)
  • Material: Ultra-Thin Transparent Polyimide / PET Inlay Film
  • Copper thickness: 1/2 OZ (18 μm) Rolled Annealed (RA) Copper
  • Surface treatment: Immersion Gold (ENIG) / Direct Contact Gold Plating
  • Minimum line width/line spacing: 0.035 mm / 0.035 mm
  • PI reinforcement thickness: PI Contact Finger Stiffener (0.10 mm)
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Antenna Inlay Layout for a Dual-Interface Card

Antenna Inlay Layout for a Dual-Interface Card

An NFC antenna inlay FPC combines an etched antenna with the connection points required by a dual-interface card module. Geometry, module coupling and surrounding card materials all belong in the design review.

Specify Antenna Measurement Conditions

Specify Antenna Measurement Conditions

Provide the antenna artwork, interface details and electrical acceptance targets. Evaluate the finished card with the intended module and readers rather than assuming a read range from the circuit material alone.

Prepare a Project-Specific RFQ

Prepare a Project-Specific RFQ

Send antenna artwork, card module specification, coupling details and electrical test requirements, together with revision-controlled fabrication files and expected quantities. Teleconix can review the proposed construction and clarify open questions for quotation. Confirm the final specification, inspection scope and delivery schedule in the agreed project documents.

Related planning guides: Consumer Electronics FPC: An OEM Integration Checklist; Flexible PCB RFQ: An OEM Guide to Manufacturing Files.

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100% Secure NDA Protection

100% Secure NDA Protection

Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.

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24-Hour Engineering Feedback

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Flexible Prototyping to Mass Scale

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Turnkey FPC Assembly (FPCA)

Turnkey FPC Assembly (FPCA)

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