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Foldable Smartphone Dynamic Hinge Multi-Layer Interconnect FPC

Foldable Smartphone Dynamic Hinge Multi-Layer Interconnect FPC

  • Board thickness: 0.075 mm (75 μm)
  • Material: Ultra-Thin Adhesiveless Polyimide (FCCL)
  • Copper thickness: 1/3 OZ (12 μm) High-Ductility Rolled Annealed (RA) Copper
  • Surface treatment: ENIG (Electroless Nickel Immersion Gold)
  • Minimum line width/line spacing: 0.030 mm / 0.030 mm
  • PI reinforcement thickness: Laser-Cut PI Stiffener (0.10 mm) + Double-Sided Matte Black Conductive Shielding Film
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Interconnect Routing Through a Foldable Phone Hinge

Interconnect Routing Through a Foldable Phone Hinge

A foldable phone hinge FPC carries connections between sections of a folding handset. Its route must be evaluated throughout hinge travel, including clearances, support locations and connector transitions.

Agree Motion and Signal Acceptance

Agree Motion and Signal Acceptance

Provide the hinge geometry, cycle profile, electrical interfaces and any impedance requirements. Prototype testing should represent the actual assembly and movement; a generic bend count does not establish service life.

Prepare a Project-Specific RFQ

Prepare a Project-Specific RFQ

Send hinge model, movement profile, display and camera interfaces and validation plan, together with revision-controlled fabrication files and expected quantities. Teleconix can review the proposed construction and clarify open questions for quotation. Confirm the final specification, inspection scope and delivery schedule in the agreed project documents.

Related planning guides: Controlled Impedance Flex PCB: An OEM Planning Guide; Flexible PCB RFQ: An OEM Guide to Manufacturing Files.

Proven Application Solutions for Your Industry

Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.

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Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.

100% Secure NDA Protection

100% Secure NDA Protection

Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.

24-Hour Engineering Feedback

24-Hour Engineering Feedback

Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.

Flexible Prototyping to Mass Scale

Flexible Prototyping to Mass Scale

Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.

Turnkey FPC Assembly (FPCA)

Turnkey FPC Assembly (FPCA)

We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.

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