Ultra-Thin AMOLED & OLED Driver FPC
Model: TLX-DFPC-OLED01
Board thickness: 0.08 mm
Copper thickness: 1/3 OZ (12 μm)
Custom Flexible PCB OEM / ODM Services
Discuss custom flex and rigid-flex projects from design-file review through prototype approval and production planning. Define the engineering scope, materials, quantities and acceptance criteria with Teleconix.
Custom Flexible PCB OEM / ODM Services
Discuss custom flex and rigid-flex projects from design-file review through prototype approval and production planning. Define the engineering scope, materials, quantities and acceptance criteria with Teleconix.
Home OEM / ODM
Tailored Manufacturing Partnerships for Your Hardware Lifecycle
Choose a build-to-print project or discuss the scope of design support you need. Agree responsibilities and deliverables before starting the work.
OEM Model
Build-to-print OEM: Supply approved fabrication files, drawings and the required construction. For assembled boards, add the BOM and placement data.
Review manufacturing questions, agree any design changes and define the inspection and delivery scope before the build.
Related planning guides: Flexible PCB RFQ: An OEM Guide to Manufacturing Files.
ODM Model
Design-support scope: Share the electrical interfaces, mechanical envelope and intended operating conditions. Discuss which layout, material or stack-up decisions need engineering input.
Agree ownership, responsibilities and deliverables for the specific project; the customer retains responsibility for system requirements and approval.
Related planning guides: Flexible PCB Design Guidelines: An OEM DFM Checklist.
Factory-Direct Capabilities & Scalable Production Capacity
Review the proposed layer construction, materials, routing and assembly requirements with Teleconix. Confirm applicable manufacturing limits against the project drawings.
| Project | Type | Capability Specification/Accuracy |
|---|---|---|
| Minimum linewidth/line spacing | Single-sided/Double-sided Board | 0.04/0.04mm (1.6mil) |
| Multilayer Board | 0.05/0.05mm (2mil) | |
| Minimum hole diameter | Drilling | 0.1mm (4mil) |
| Laser Hole | 0.05mm | |
| Dimensional tolerance | Line Width | +10% (W>=0.05mm) |
| Hole Diameter | +0.05mm (R>=0.6mm) | |
| Gross Tolerance | +0.05mm | |
| Silkscreen Tolerance | +0.2mm | |
| Cover Film Lamination Tolerance | +0.1mm | |
| Layer/thickness | Single-sided Board | MIN 0.056mm |
| Double-sided Board | MIN 0.1mm (1/3oz glue-free electrolytic) | |
| Multilayer Board Capability | 1-8 layers | |
| Surface treatment | Nickel-Gold Plating | Au: 0.03-0.2um |
| Chemical Nickel-Gold Plating | Au: <=0.75um | |
| Nickel-Palladium-Gold Plating | Au: 0.03-0.2um | |
| Pure Tin Plating | Pd: 0.05um | |
| Impedance | Differential Impedance | Sn: 5-15um |
| Characteristic Impedance | 100+-10%O | |
| 50+10%O |
A Transparent, Four-Step Pipeline from File to Factory Floor
Move from a revision-controlled design package to an approved prototype and documented production release.
Step 01
Design Package Review
Before ToolingReview the circuit files, material construction and installed bend geometry. Define the prototype scope and acceptance criteria before tooling.
Step 02
Prototype Build
Agreed Prototype ScheduleCheck the prototype in its intended assembly. Record electrical, mechanical and functional results and resolve design changes before production approval.
Step 03
Inspection and Acceptance
Before Production ApprovalReview the agreed inspection and functional results. Record discrepancies and approve any changes to the design package.
Step 04
Production Planning
Agreed Release and ScheduleAgree the approved revision, quantities, inspection documentation and delivery schedule. Keep changes traceable throughout the production project.
Custom Flexible Circuit Structures Built to Your Specifications
Choose a flexible or rigid-flex construction around the installed shape, electrical interfaces and assembly needs of your hardware.
Multi-Branch Humanoid Robotic Joint FPC
Model: TLX-ROB-JNT01
Board thickness: 0.15 mm
Copper thickness: 1 OZ (35 μm) Rolled Annealed (RA) Copper
Heavy-Copper ESC & Propulsion Power Distribution FPC
Model: TLX-AERO-ESC01
Board thickness: 0.25 mm
Copper thickness: 3 OZ (105 μm) / 4 OZ Heavy Copper
Heavy-Copper EV Battery Pack BMS & CCS FPC
Model: TLX-AUTO-BMS01
Board thickness: 0.22 mm
Copper thickness: 3 OZ (105 μm) Heavy Copper
Biometric Smart Payment Card Fingerprint Sensor FPC
Model: TLX-CARD-BIO01
Board thickness: 0.045 mm (45 μm)
Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
5G mmWave Antenna Array & RF Front-End LCP FPC
Model: TLX-COMM-5G01
Board thickness: 0.10 mm
Copper thickness: 1/3 OZ (12 μm) Ultra-Smooth Rolled Annealed (RA) Copper
Rigorous Quality Assurance & International Compliance Standards
Define inspection records, material traceability and supplier qualification documents for your project. Request current certificates and confirm their applicable scope.
ISO14000
ISO14000
ISO14000
ISO14000
ISO14000
Frequently Asked OEM/ODM Manufacturing Questions
Get direct answers about order minimums, production timelines, DFM, quality verification, and secure file handling.
We maintain flexible MOQ policies to support our clients at every development stage. We accept low-volume prototype orders (from 5 to 50 pcs) for design verification and pilot runs. Once qualified, our high-speed Roll-to-Roll (R2R) exposure and automated assembly lines scale effortlessly to millions of units per month with consistent yield and competitive volume pricing.
Technical Insights & System Design Guides
Use these design and sourcing guides to prepare your OEM project brief and clarify quotation requirements.
Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.