We treat client IP with the highest level of security. We sign mutual Non-Disclosure Agreements (NDAs) prior to receiving any design files. All CAD data, Gerber archives, schematics, and firmware files are stored on isolated, encrypted internal servers with strict role-based access control. Our facilities operate 24/7 security surveillance to ensure zero unauthorized exposure of proprietary technologies.

Every project is manufactured under strict international standards, including ISO 9001:2015, ISO 13485 (Medical Devices), IATF 16949 (Automotive), and IPC-6013 Class 3 (Aerospace/High Reliability). Quality verification includes 100% netlist electrical testing (E-test), Laser Direct Imaging (LDI), Automated Optical Inspection (AOI), 3D X-Ray solder joint analysis, TDR impedance verification, thermal shock cycling, and dynamic flex endurance testing.

Yes. Our ISO-certified Class 10,000 dust-free SMT facility provides 100% turnkey assembly. We procure authentic electronic components directly from authorized global distributors (Mouser, Digi-Key, Arrow, and original chip makers) with full CoC traceability. Our automated pick-and-place lines reliably handle ultra-compact 0201 passives, micro-BGA packages (0.35mm pitch), fine-pitch Board-to-Board (B2B) connectors, and specialized sensors using custom magnetic pallet fixtures.

We operate dedicated quick-turn prototyping lines. For standard 1-layer and 2-layer FPC prototypes, our turnaround time is as fast as 24 to 48 hours. Multi-layer flex and rigid-flex prototypes typically ship within 3 to 5 business days following final DFM sign-off, enabling hardware startups and tier-1 OEMs to accelerate their New Product Introduction (NPI) verification cycles.

We offer end-to-end turnkey OEM and ODM solutions for single-sided, double-sided, multi-layer FPCs, and rigid-flex circuits. Our capabilities span engineering consultation, comprehensive DFM (Design for Manufacturability) analysis, precision flex PCB fabrication, global component sourcing, turnkey SMT assembly (FPCA), automated conformal coating/potting, custom stiffener/connector integration, and final module testing and packaging.