Teleconix delivers advanced flexible interconnects for ADAS, in-vehicle infotainment, powertrain control, and battery management systems — engineered for performance in intelligent automotive systems.
Teleconix delivers advanced flexible interconnects for ADAS, in-vehicle infotainment, powertrain control, and battery management systems — engineered for performance in intelligent automotive systems.
Electric vehicles and intelligent cockpits operate under extreme under-the-hood temperatures, non-stop road vibration, and severe cabin space limits where electrical reliability is paramount.
Powertrains, EV battery modules, and engine bay sensors operate continuously in harsh environments from -40°C to +125°C (withstand up to +150°C peaks). We utilize high-Tg adhesiveless polyimide (FCCL) and flame-retardant coverlays to prevent thermal expansion, trace oxidation, and layer delamination.
Automotive chassis, wheel hubs, and powertrain controllers endure continuous high-G shock and rough road oscillations. Engineered to AEC-Q200 standards, our FPCs incorporate ductile rolled annealed (RA) copper, optimized bend radii, and localized stainless steel or FR4 stiffeners to eliminate solder joint fractures.
EV range extension and complex smart cockpits require extreme spatial efficiency. Our ultra-thin multi-layer automotive FPCs replace heavy, bulky round wire harnesses—delivering up to 70% space and weight reduction across door modules, BMS battery cell arrays, and curved dashboard displays.
Our automotive flexible circuits combine wide-temperature resilience, high-speed ADAS sensor signal integrity, heavy copper power distribution, and ultra-thin dynamic profiles for next-generation intelligent electric vehicles and smart cockpits.
High-Tg polyimide and low-loss LCP substrates rated for extreme under-the-hood, powertrain, and battery compartment operating environments from -40°C to +125°C (withstanding +150°C thermal peaks). Engineered to resist automotive oil exposure, thermal shock, and layer delamination.
Fine-pitch impedance-controlled routing down to 0.035mm line/space with integrated silver/copper EMI shielding grids. Delivers low-latency, lossless data transmission for high-resolution automotive cameras, LiDAR, and 77GHz radar sensor fusion modules.
Heavy copper traces up to 3 oz/4 oz combined with integrated surface-mount NTC temperature sensors and laser-welded nickel terminal tabs. Directly replaces rigid busbars and bulky wiring harnesses in EV battery packs for ultra-precise cell voltage and temperature monitoring.
Sub-0.08mm ultra-thin flexible circuits designed for tight bend radii (<0.5mm) and seamless integration behind panoramic curved OLED dashboard screens, HUD projectors, multi-function steering wheels, and automotive door hinges.
We eliminate the sales fluff and middlemen. Our dedicated engineering squad works directly with your Gerber files to optimize your layouts for manufacturing, reducing production risks and field failures while maintaining strict cost advantages.
Precision etching, laser drilling, and automated optical inspection lines dedicated to flexible circuit production.
Flying probe and fixture-based testing verifies every net for opens, shorts, and impedance compliance before shipment.
Certified polyimide, copper, and adhesive materials with full lot traceability for automotive and medical accountability.
DFM-driven stack-up design tailored to your exact bend radius, layer count, impedance, and form-factor requirements.
Flexible interconnects for UAVs, robotics, sensors, and avionics systems.
Model: TLX-DFPC-OLED01
Model: TLX-ROB-JNT01
Model: TLX-AERO-ESC01
Model: TLX-AUTO-BMS01
Model: TLX-CARD-BIO01
Model: TLX-COMM-5G01
Find quick answers to common technical queries regarding IATF 16949 compliance, EV battery pack BMS integration, high-speed ADAS signal integrity, wide-temperature automotive substrates, and turnkey SMT assembly for Smart Automotive FPCs.
Yes. Operating under strict IATF 16949 and ISO 9001 automotive quality management systems, our Class 10,000 cleanroom manufacturing facility supports seamless scaling from PPAP Level 3 sample verification to full-scale volume production. We maintain automated Roll-to-Roll (R2R) exposure lines, continuous laser etching, and high-speed SMT lines backed by 100% automated optical inspection (AOI) and comprehensive batch traceability.
Teleconix rugged FPCs provide reliable signal and power distribution in aerospace, robotics, and industrial field equipment.
Overcome severe mechanical stress and extreme spatial constraints in your automated hardware. We design and manufacture custom flexible circuits engineered to endure over 2 million continuous bending cycles in multi-axis robotic joints, bionic grippers, and autonomous AGV/AMR platforms.
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Teleconix manufactures fine-pitch, high-density FPCs for LCD, OLED, mini-LED displays, camera modules, and optical sensors — delivering stable signal transmission and exceptional brightness control.
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Teleconix manufactures aerospace-grade flexible circuits built to IPC-6013 Class 3 standards for industrial drones, flight avionics, multi-axis gimbals, and satellite systems — delivering superior SWaP weight reduction, extreme thermal endurance, and fail-safe signal integrity.
Know MoreExplore engineering articles, design guides, and application notes from our R&D team to optimize your next FPC or rigid-flex project.
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
Need a reliable manufacturing partner for your next project? Our global support team is standing by.
Trusted by global industries for high-reliability FPC, rigid-flex PCB, and turnkey FPC assembly solutions.
