Consumer Electronics & Smart Card FPC Solutions
Custom consumer electronics and smart card FPC solutions for NFC inlays, TWS earbuds and wearables. Plan stack-ups, interfaces, assembly and OEM prototype acceptance with Teleconix.
Smart Wearable Health Ring & Biosensor Multi-Flex FPC
- Board thickness: 0.06 mm (60 μm)
- Material: Biocompatible Adhesiveless Polyimide (FCCL)
- Copper thickness: 1/3 OZ (12 μm)
- Surface treatment: ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
- Minimum line width/line spacing: 0.025 mm / 0.025 mm (25 μm / 25 μm)
- PI reinforcement thickness: Ultra-Thin Laser-Cut PI Stiffener (0.06 mm)
Curved Sensor Routing in a Smart Ring
A smart ring FPC links sensing, control and power elements within a curved ring housing. Its outline should follow the chosen ring geometry and the positions of optical windows and other interfaces.
Review the Complete Wearable Assembly
Provide the sensor BOM, installed curvature, enclosure design and any sealing or contact requirements. Evaluate function and environmental performance at the assembled device level.
Prepare a Project-Specific RFQ
Send ring housing model, sensor positions, power interface and enclosure requirements, together with revision-controlled fabrication files and expected quantities. Teleconix can review the proposed construction and clarify open questions for quotation. Confirm the final specification, inspection scope and delivery schedule in the agreed project documents.
Related planning guides: Consumer Electronics FPC: An OEM Integration Checklist; Flexible PCB RFQ: An OEM Guide to Manufacturing Files.
Proven Application Solutions for Your Industry
Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.
Know More
Explore Related Flexible Circuit Hardware
Biometric Smart Payment Card Fingerprint Sensor FPC
Model: TLX-CARD-BIO01
Board thickness: 0.045 mm (45 μm) Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
Dynamic CVV & e-Paper Display Smart Card FPC
Model: TLX-CARD-CVV02
Board thickness: 0.06 mm (60 μm) Copper thickness: 1/3 OZ (12 μm)
High-Q Precision Etched Dual-Interface NFC Antenna Inlay FPC
Model: TLX-CARD-NFC03
Board thickness: 0.05 mm (50 μm) Copper thickness: 1/2 OZ (18 μm) Rolled Annealed (RA) Copper
Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.