Medical Device FPC Solutions
Medical device FPC solutions for diagnostic equipment and patient monitoring. Review compact routing, signal paths, materials and prototype requirements with Teleconix.
Wearable Continuous Glucose Monitor (CGM) & Biosensor Patch FPC
- Board thickness: 0.05 mm (50 μm)
- Material: ISO 10993 Certified Biocompatible Adhesiveless Polyimide (FCCL)
- Copper thickness: 1/3 OZ (12 μm)
- Surface treatment: ENIG (Electroless Nickel Immersion Gold) / Hard Gold Plating
- Minimum line width/line spacing: 0.030 mm / 0.030 mm
- PI reinforcement thickness: Ultra-Thin Laser-Cut PI Stiffener (0.05 mm) + Medical-Grade Adhesive (PSA) Liner
Sensor Connections in a CGM Patch
A CGM patch FPC connects sensing, control and power elements within a wearable monitoring device. The circuit layout should follow the enclosure, sensor interface and selected components.
Define the Contact and Protection Boundary
State whether the flex is enclosed or exposed and provide the required environmental and device qualification criteria. Skin-contact suitability and wear duration must be established for the finished device and its materials.
Prepare a Project-Specific RFQ
Send patch envelope, sensor interface, component BOM and device contact requirements, together with revision-controlled fabrication files and expected quantities. Teleconix can review the proposed construction and clarify open questions for quotation. Confirm the final specification, inspection scope and delivery schedule in the agreed project documents.
Related planning guides: Flexible PCB Design Guidelines: An OEM DFM Checklist; Flexible PCB RFQ: An OEM Guide to Manufacturing Files.
Proven Application Solutions for Your Industry
Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.
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Model: TLX-MED-ENDO01
Board thickness: 0.07 mm (70 μm) Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
High-Frequency Ultrasound Transducer Probe Multi-Layer FPC
Model: TLX-MED-USND02
Board thickness: 0.12 mm (4-Layer High-Density Flex) Copper thickness: 1/2 OZ (18 μm) Rolled Annealed (RA) Copper
Implantable Neurostimulation & Cardiac Pacemaker Micro-Flex Circuit
Model: TLX-MED-IMPL04
Board thickness: 0.06 mm (60 μm) Copper thickness: 1/3 OZ (12 μm) Ultra-Smooth Foil
Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.