Medical Device FPC Solutions
Medical device FPC solutions for diagnostic equipment and patient monitoring. Review compact routing, signal paths, materials and prototype requirements with Teleconix.
High-Frequency Ultrasound Transducer Probe Multi-Layer FPC
- Board thickness: 0.12 mm (4-Layer High-Density Flex)
- Material: Ultra-Low-Loss Liquid Crystal Polymer (LCP) / High-Tg Polyimide
- Copper thickness: 1/2 OZ (18 μm) Rolled Annealed (RA) Copper
- Surface treatment: ENEPIG (Wire-Bondable Gold)
- Minimum line width/line spacing: 0.035 mm / 0.035 mm
- PI reinforcement thickness: Micro-Pitch FR4 Stiffener (0.20 mm) + Double-Sided Copper EMI Shielding Grid
Dense Connections Within an Ultrasound Probe
An ultrasound probe FPC connects transducer and processing interfaces within a compact probe assembly. Channel mapping, connector transitions and the installed flex route need to be coordinated with the probe design.
Review Channel and Assembly Requirements
Provide the channel count, pin mapping, grounding requirements and any electrical targets. Define the mechanical support and acceptance tests for the complete probe connection, including its documented exposure conditions.
Prepare a Project-Specific RFQ
Send probe drawings, transducer interface, channel map and electrical acceptance plan, together with revision-controlled fabrication files and expected quantities. Teleconix can review the proposed construction and clarify open questions for quotation. Confirm the final specification, inspection scope and delivery schedule in the agreed project documents.
Related planning guides: Flexible PCB Design Guidelines: An OEM DFM Checklist; Flexible PCB RFQ: An OEM Guide to Manufacturing Files.
Proven Application Solutions for Your Industry
Our custom flexible circuits are built to integrate seamlessly into complex, high-performance hardware systems. Explore our tailored application solutions below to see how we help global engineering teams solve spatial, thermal, and mechanical challenges at the system level.
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Board thickness: 0.07 mm (70 μm) Copper thickness: 1/3 OZ (12 μm) Rolled Annealed (RA) Copper
Wearable Continuous Glucose Monitor (CGM) & Biosensor Patch FPC
Model: TLX-MED-CGM03
Board thickness: 0.05 mm (50 μm) Copper thickness: 1/3 OZ (12 μm)
Implantable Neurostimulation & Cardiac Pacemaker Micro-Flex Circuit
Model: TLX-MED-IMPL04
Board thickness: 0.06 mm (60 μm) Copper thickness: 1/3 OZ (12 μm) Ultra-Smooth Foil
Accelerate Your Project: Request an Instant FPC & Rigid-Flex Quote
Partner with an IATF 16949 certified rigid flex PCB manufacturer. Submit your specs for a free engineering DFM review and detailed commercial quote within 24h.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.
100% Secure NDA Protection
Your intellectual property is completely safe. We strictly enforce mutual Non-Disclosure Agreements (NDA) prior to evaluating any custom Gerber files or project blueprints.
24-Hour Engineering Feedback
Our R&D matrix of over 100 specialists guarantees a formal commercial quote and initial Design for Manufacturability (DFM) assessment within 1 business day.
Flexible Prototyping to Mass Scale
Enjoy zero MOQ restrictions for your initial flexible pcb prototype service, with seamless scaling to high-volume automotive, medical, and aerospace production runs.
Turnkey FPC Assembly (FPCA)
We deliver fully functional, populated hardware. Our smart SMT center eliminates secondary sourcing headaches with verified 99.8% component placement accuracy.