Industrial UAV & Commercial Aerospace FPC

Yes. Our Class 10,000 dust-free SMT facility handles complete turnkey assembly. We use custom magnetic carrier fixtures to place fine-pitch Board-to-Board (B2B) connectors, micro-BGA sensors, and 0201 passive components onto ultra-thin flex substrates with 100% AOI and 3D X-Ray solder joint verification.

We use premium rolled annealed (RA) copper foil combined with customized polyimide or aluminum stiffeners to absorb mechanical shock and continuous high-G flight vibration. Every flex circuit design undergoes rigorous dynamic bending simulation and 100% electrical continuity testing to prevent micro-cracking during long-term rotation.

We utilize high-Tg adhesiveless polyimide (FCCL) and Liquid Crystal Polymer (LCP) substrates paired with high-performance thermosetting coverlays. Our aerospace FPCs are fully qualified to operate continuously under severe thermal shock environments ranging from -55°C to +125°C without delamination, outgassing, or trace cracking.

Replacing bulky wire harnesses with customized multi-layer FPCs or rigid-flex circuits can reduce interconnect weight and volume by up to 60% to 70%. This massive reduction in dead weight directly extends drone flight endurance, lowers power consumption, and maximizes payload capacity for HD optical cameras and LIDAR sensors.

Yes. Our aerospace and industrial UAV flexible circuits are manufactured under certified IATF 16949 / ISO 9001 quality systems with full traceability. We offer IPC-6013 Class 3 high-reliability fabrication capabilities, ensuring zero-defect performance for mission-critical flight controllers, satellite payloads, and 3-axis drone camera gimbals.