Medical device FPC

Yes. Our ISO 13485 certified SMT facility handles turnkey assembly inside a Class 10,000 cleanroom. We reliably place fine-pitch Board-to-Board (B2B) connectors, 0201 passive components, micro-BGA sensor ICs, and optical sensors onto flexible substrates, backed by 100% AOI and 3D X-Ray solder inspection.

Medical devices undergo demanding hygiene procedures. Our medical FPCs utilize specialized high-thermal polyimide substrates and cross-linked thermosetting adhesive formulations that endure repeated autoclave steam sterilization (up to +134°C), gamma irradiation, and harsh chemical wiping without trace delamination or solder joint degradation.

Biosignals (such as ECG, EEG, and high-frequency ultrasound feeds) are extremely delicate. We integrate ultra-thin conductive silver ink layers, copper grid shielding, or black EMI shielding films onto multi-layer FPCs, delivering up to 50dB shielding effectiveness to block external electromagnetic interference and maintain crystal-clear signal feeds.

We process medical-grade adhesiveless polyimide (FCCL) and specialized biocompatible coverlays tested in accordance with ISO 10993 standards. These materials ensure zero cytotoxicity and non-irritation, making them completely safe for non-invasive wearables, surgical endoscopes, and diagnostic equipment in direct or indirect human contact.

Using high-precision Laser Direct Imaging (LDI), we manufacture ultra-fine trace width and spacing down to 0.035 mm / 0.035 mm (1.4 mil). We strongly recommend coplanar ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface plating to enable reliable micro-wire bonding, micro-BGA soldering, and high-density IC attachment for ultrasound transducers and endoscopic camera tips.